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  2. Zen 3 uses a unified complex, in which each CCD now contains a single CCX with a unified 32 MB L3 cache. This unified CCD design completely eliminates CCX-to-CCX communication, greatly improving core-to-core latency. On the other hand, AMD reused the chiplet design, with one or two CCDs (fabricated on 7 nm) paired with a 12 nm IOD (I/O Die).
    www.techarp.com/computer/amd-zen-3-tech-report/
    www.techarp.com/computer/amd-zen-3-tech-report/
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    Zen 3 - Wikipedia

    In Zen 3, a single 32MB L3 cache pool is shared among all 8 cores in a chiplet, vs. Zen 2's two 16MB pools each shared among 4 cores in a core complex, of which there were two per chiplet. See more

    Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O … See more

    Zen 3+ is the codename for a refresh of the Zen 3 microarchitecture, which focuses on power efficiency improvements. It was released in April … See more

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    As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase … See more

     
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