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    Back-grinding Tape for wafer with solder bumping |Tape for Semiconductor Process|Furukawa Electric Co., Ltd.
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    The process of manufacturing silicon wafers involves several steps:
    1. Silicon Ingot Growth: High-purity silicon ingots are produced through the Czochralski or Float Zone method.
    2. Silicon Ingot Slicing: The ingots are sliced into thin wafers.
    3. Surface Polishing: The wafers are polished to achieve a smooth surface.
    4. Wafer Cleaning: The wafers are thoroughly cleaned.
    5. Photolithography: Patterns are created on the wafers using light exposure.
    6. Etching and Doping: Chemical processes are used to modify the wafers.
    7. Deposition and Thin Film Formation: Additional layers are added to the wafers.
    8. Thermal Processing: The wafers are heated to enhance their properties.
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