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2024 | News | DISCO Corporation
Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …
DISCO Corporate History | About DISCO | DISCO Corporation
Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had …
株式会社ディスコ - DISCO
DISCO Technical Review Kiru(切る)・Kezuru(削る)・Migaku(磨く)技術に関する技術見解・ 論文のページです。
Corporate Philosophy | About DISCO | DISCO Corporation
DISCO Values represent the corporate philosophy that identifies the ideal from various perspectives, including the direction in which the company should progress, the basic …
2025年 | ニュース | 株式会社ディスコ - disco.co.jp
Feb 12, 2025 · 半導体製造装置メーカー・株式会社ディスコ(本社:東京都大田区、社長:関家一馬)は、Great Place to Work ® Institute Japan(GPTW ※ ジャパン)が主催する、2025 …
DFL7161 | Laser Saws | Product Information | DISCO Corporation
DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use. It performs a series of processes from HogoMax * coating and dicing to automatic cleaning. The …
2023 | News | DISCO Corporation
Oct 23, 2023 · DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed a new ABC (Auto …
DISCO Corporation
DISCO Technical Review 有关 Kiru(切)・Kezuru(削)・Migaku(磨)技术的见解和论文。
Accessory Equipment | Product Information | DISCO Corporation
Deionized Water Recycling Unit Deionized water recycling unit combines the capabilities of producing deionized water, controlling the water temperature, filtering, and waste water …
2024 | News | DISCO Corporation
Dec 6, 2024 · DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DFD6370, a fully …