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  1. Nature
    https://www.nature.com › articles

    Three-dimensional integration of two-dimensional field-effect ...

    • In the field of semiconductors, three-dimensional (3D) integration not only enables packaging of more devices per unit area, referred to as ‘More Moore’1 but also introduces multifunctionalities for ‘More t… See more

    Main

    Scaling of silicon field-effect transistors (FETs) following Moore’s law has been instrumental in … See more

    Nature
    3D integration of 2D FETs

    MoS2 and WSe2 films used in this study were grown on epi-ready 2-inch c-plane sapphire (α-Al2O3) substrates using metal-organic chemical vapour deposition. The growth par… See more

    Nature
    Two-tier wafer-scale 3D stack of MoS2 FETs

    Electrical characterization on different tiers was performed sequentially and before depositing necessary vias and connections for circuit demonstrations. Figure 2a,b shows the t… See more

    Nature
    Three-tier 3D stack of 2D FETs

    We establish the robustness of the fabrication process flow to a higher number of tiers by demonstrating three-tier 3D integrated chips based on MoS2 and WSe2. A M… See more

    Nature
    Scaled 2D FETs in a two-tier 3D stack

    After achieving two-tier wafer-scale 3D integration of MoS2 FETs and three-tier 3D integration for both MoS2 and WSe2 FETs, the same fabrication flow was used to fabricate tw… See more

    Nature
    What is the main challenge in 3D integration?
    Main challenge in 3D integration is how to partition the system to come up with better utilization of devices, interconnect and sub-systems such as memory, analog, and I/O. Parasitics improvement will become the major knob for performance improvement for nodes spanning between 2017 and 2024.
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    Table of Contents
    Main
    3D integration of 2D FETs
    Two-tier wafer-scale 3D stack of MoS2 FETs
    Three-tier 3D stack of 2D FETs
    Scaled 2D FETs in a two-tier 3D stack
    What is the main challenge in 3D integration?
     

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  2. IEEE Xplore
    https://ieeexplore.ieee.org › document

    More Moore: From device scaling to 3D integration and system …

     
  3. IEEE IRDS
    https://irds.ieee.org › images › files › pdf › Technical...
    [PDF]

    IRDS: Device Characteristics for More Moore and …

  4. Nature
    https://www.nature.com › articles

    Monolithic three-dimensional integration of complementary two

  5. IEEE Xplore
    https://ieeexplore.ieee.org › abstract › document

    More Moore: From device scaling to 3D integration and system …

  6. Nature
    https://www.nature.com › articles

    3D integration of 2D electronics - Nature

  7. People also ask
    Is 3D integration more than Moore?
    These strategies are often called ‘more than Moore’. One promising more-than-Moore strategy is the three-dimensional (3D) integration of different layers of active electronic components 3 and, in particular, the device-level integration approach termed monolithic 3D integration.

    Adding a new layer to ‘more than Moore’ | Nature Electronics

    nature.com
    Is monolithic 3D integration a 'more Moore' or'more than Moore' approach?
    Challenges and future prospects Monolithic 3D integration brings several opportunities in the “More Moore” and “More than Moore” approach, meanwhile many challenges are also lying ahead.

    Emerging monolithic 3D integration: Opportunities and

    sciencedirect.com
    What is the main challenge in 3D integration?
    Main challenge in 3D integration is how to partition the system to come up with better utilization of devices, interconnect and sub-systems such as memory, analog, and I/O. Parasitics improvement will become the major knob for performance improvement for nodes spanning between 2017 and 2024.

    2016 EDITION - IEEE

    irds.ieee.org
    Is monolithic 3D integration a viable solution to Moore's law?
    To deal with this challenge, monolithic 3D (M3D) integration was proposed recently , and is becoming a promising solution to increase integration density for better PPA and continue Moore’s law economically. There are a few good surveys on monolithic 3D integration already such as , .

    Emerging monolithic 3D integration: Opportunities and

    sciencedirect.com
    What is 3D integration of 2D materials?
    3D integration of 2D materials has various applications, as depicted in Fig. 3. These applications can fall into two categories: (1) stacking 2D materials to maximize area utilization and facilitate scaling, and (2) integrating 2D materials or devices on top of silicon-based logic or memory devices.

    3D integration of 2D electronics - Nature

    nature.com
    Why do we need a 3D integration in 2031?
    The challenge of such integration in 3D is how to partition the system to come up with better utilization of devices, interconnects, and sub-systems such as memory, analog, and I/O. That is why the functional scaling and/or significant architectural changes are required after 2031.

    IRDS 2021 More Moore - IEEE

    irds.ieee.org
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  8. IEEE IRDS
    http://irds.ieee.org › images › files › pdf
    [PDF]

    2016 EDITION - IEEE

  9. IEEE IRDS
    https://irds.ieee.org › images › files › pdf
    [PDF]

    IRDS 2021 More Moore - IEEE

  10. Penn State Engineering
    https://news.engr.psu.edu › moores-la…

    Integrating dimensions to get more out of Moore’s Law …

    Jan 10, 2024 · Penn State researchers demonstrated 3D integration of semiconductors at a massive scale, characterizing tens of thousands of devices using 2D transistors made with 2D semiconductors, enabling electronic …

  11. IEEE Xplore
    https://ieeexplore.ieee.org › document

    The bridge between More than Moore and More Moore - IEEE …

  12. ScienceDirect
    https://www.sciencedirect.com › science › article › pii

    Emerging monolithic 3D integration: Opportunities and challenges …

  13. Nature
    https://www.nature.com › articles

    Adding a new layer to ‘more than Moore’ - Nature

  14. Materials Research Institute at Penn State
    https://www.mri.psu.edu › integrating-dimensions-get...

    Integrating dimensions to get more out of Moore’s Law

  15. ScienceDaily
    https://www.sciencedaily.com › releases

    Integrating dimensions to get more out of Moore's Law and …

  16. Nature
    https://www.nature.com › articles
    [PDF]

    The future of two-dimensional semiconductors beyond Moore …

  17. IEEE IRDS
    https://irds.ieee.org › images › files › pdf
    [PDF]

    INTERNATIONAL ROADMAP - IEEE

  18. Tech Xplore
    https://techxplore.com › news
    [PDF]

    Integrating dimensions to get more out of Moore's Law and …

  19. Nature
    https://www.nature.com › articles

    2D materials-based 3D integration for neuromorphic hardware

  20. IEEE Xplore
    https://ieeexplore.ieee.org › document

    More-Than-Moore: 3D heterogeneous integration into CMOS …

  21. Pennsylvania State University
    https://www.psu.edu › news › materials-research...

    Integrating dimensions to get more out of Moore’s Law and …