This complex process involves the use of materials like silicon, epitaxial layers, photoresist, and metal and dielectric films to create microchips and other semiconductor devices. In this article, we will explore the purpose of wafer fabrication, the materials used, the steps involved, and the different types of wafer fabrication processes.

The semiconductor fabrication process is a complex and highly detailed journey from raw silicon to advanced microchips, involving many intricate steps like photolithography, doping, and metallization.

Discover the process of creating microchips, from silicon to electronic devices, encompassing history, fabrication phases, and technological progress.

To make a computer chip, it all starts with the Czochralski process. The first step of this process is to take extremely pure silicon and melt it in a crucible that is often made of quartz.

Let’s discuss six critical semiconductor manufacturing steps: deposition, photoresist, lithography, etch, ionization and packaging. The process begins with a silicon wafer. Wafers are sliced from a salami-shaped bar of 99.99% pure silicon (known as an 'ingot') and polished to extreme smoothness.