Feature size is determined by the width of the smallest lines that can be patterned in a semiconductor fabrication process, this measurement is … See more

When feature widths were far greater than about 10 micrometres, semiconductor purity was not as big of an issue as it is today in device manufacturing. In the 1960s, workers could work on semiconductor devices in street clothing. As devices become … See more

In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and … See more

20th century
An improved type of MOSFET technology, CMOS, was developed by Chih-Tang Sah and Frank Wanlass at Fairchild Semiconductor in … See more

This is a list of processing techniques that are employed numerous times throughout the construction of a modern electronic device; this list does not necessarily imply a specific order, nor … See more

A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots (boules) up to 300 mm (slightly … See more

The highly serialized nature of wafer processing has increased the demand for metrology in between the various processing steps. … See more