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Learn more about Bing search results hereOrganizing and summarizing search results for youWafer flatness metrology is used to determine the flatness of a wafer. The maximum peak-to-valley irregularity that a wafer exhibits when measured in relation to a reference plane is called wafer flatness. The wafer flatness at the exposure site is determined by the flatness of the wafer chuck, the Total Thickness Variation (TTV), or Global Back Ideal Range (GBIR), of the chucked wafer, and any deformation caused by the forces that make the wafer conform to the chuck.2 Sources
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Manufacturers of wafer testing equipment must create tools that allow measurement of flatness and nanotopography with sufficient accuracy and spatial resolution. Optical tools are therefore …
- Author: Ulf Griesmann, Quandou, T D. Raymond
- Publish Year: 2005
See results only from tsapps.nist.govOptical Flatness Metrology f…
At the National Institute of Standards and Technology (NIST), we are developing …
Interferometric Thickness C…
We give an overview of the design of the interferometer and discuss its …
Tropel Wafer Analysis Systems | Advanced Analytic …
All Tropel® wafer systems measure flatness, taper, thickness variation, thickness, stress, bow, warp, SORI, and all SEMI standard parameters, including stepper simulation of any wafer surface.
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Wafer Flatness - an overview | ScienceDirect Topics
Wafer flatness is defined as the variation of wafer thickness relative to a reference plane. The flatness of the wafer can be described either by a global flatness value or as the maximum …
Metrology Instruments | Corning
Corning manufactures a complete line of non-contact metrology instruments that measure surface form for flatness, parallelism, height, depth, surface finish, roughness, or thickness, with sub-micron to nanometer accuracy in just seconds.
e highest precision wafer flatness measurements. The Tropel® FlatMaster® Wafer Analysis System is ideal for processes developm. nt, particularly for new, non-silicon materials. From …
Optical Flatness Metrology for 300 mm Silicon Wafers
Apr 1, 2005 · At the National Institute of Standards and Technology (NIST), we are developing two interferometric methods for measuring the thickness variation and flatness of free-standing and …
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When properly instituted, wafer flatness metrology provides useful information that can produce improved wafer processing capabilities. The Chromatic Confocal technique uses a white light …
Lumetrics’ low coherence interferometer, commercially marketed as OptiGauge II, is a device capable of measuring the simultaneous wafer thickness, adhesive thickness, and parallelism …
New metrology technique for measuring patterned wafer …
In this paper we present Wave Front Phase Imaging (WFPI); a new patterned wafer geometry technique that measures the wave front phase utilizing two intensity images of the light …
Manufacture and Metrology of 300 mm Silicon Wafers with …
Sep 26, 2007 · We report the results of fabricating 300 mm silicon wafers with very low thickness variation using magnetorheological finishing (MRF), a deterministic subaperture finishing process.
We give an overview of the design of the interferometer and discuss its application to wafer thickness measurements. The conversion of optical thickness, as measured by the …
Interferometry for wafer dimensional metrology - SPIE Digital Library
Sep 10, 2007 · Wafer shape and thickness variation are important parameters in the IC manufacturing process. The thickness variation, also called flatness, enters the depth-of-focus …
The Transition to Optical Wafer Flatness Metrology
Sep 30, 2003 · In this paper we present a historical perspective on starting material dimensional metrology, leading to the current standard for wafer manufacturing quality control, …
Optical Flatness Metrology for 300 mm Silicon Wafers
Sep 9, 2005 · The National Institute of Standards and Technology (NIST) is developing two interferometric methods for measuring the thickness, thickness variation, and flatness of …
All accuracy and repeatability specifications reported for a 200mm diameter wafer of nominal 725 micron thickness with 0.1μm STIR and 0.9 ohm-cm resistivity. The MicroSense dual probe …
Approaching new metrics for wafer flatness: an investigation of …
In this paper we report extensive experimental results that review existing wafer flatness metrics and propose the addition of a new metric. The new metric emulates the scanning motion of …
Determination of silicon wafer site flatness using dual heterodyne ...
Jun 19, 2020 · We report on a highly precise site flatness measurement system that employs a pair of heterodyne interferometers and achieves sub-nanometer precision for polished 300-mm …
The FlatMaster® Semi-Automated Wafer flat-ness analysis system integrates a grazing-inci-dence interferometer with automated staging for improved wafer loading and measurement …
Wafer Flatness: An Overview Of Measurement Considerations …
This paper will offer an overview of the most typical wafer flatness test methods. It will demonstrate the importance of contamination considerations, show how flatness …
Optical Flatness Metrology for 300 mm Silicon Wafers - OSTI.GOV
Sep 9, 2005 · The National Institute of Standards and Technology (NIST) is developing two interferometric methods for measuring the thickness, thickness variation, and flatness of free …
